The K-31D6 High-Precision Double-Sided Mask Aligner is an advanced photolithography system designed for semiconductor and microelectronics manufacturing. Widely used in research institutions, universities, and production lines, this system is ideal for fabricating integrated circuits, semiconductor devices, optoelectronic components, surface acoustic wave (SAW) devices, thin-film circuits, and power electronics.

Core Features and Advantages:

• Broad Application Range: Supports substrates up to 150 × 150 mm and thickness up to 5 mm, including irregular and non-circular wafers. Capable of double-sided simultaneous exposure as well as single-sided exposure.

• High Structural Stability: Equipped with ball-screw Z-axis linear guide, vacuum contact system with hard, soft, and micro-force contact modes, vacuum chuck, and anti-adhesion mechanism to ensure reliable wafer handling and alignment accuracy.

• User-Friendly Operation: Manual X/Y/Q alignment adjustments with simple button controls for vacuum chucking and air blow-back, ensuring easy setup, calibration, and maintenance.

• Exceptional Reliability: Built with imported Japanese solenoid valves, buttons, and timers, along with a robust pneumatic and vacuum system for high operational consistency and extended service life.

• Customizable Design: Optional special substrate holders are available to accommodate non-standard, irregular, or fragile substrates, ensuring precise alignment even under challenging conditions.

Technical Specifications:

• Exposure Type: Mask-to-mask double-sided alignment

• Exposure Area: Up to 150 × 150 mm

• Illumination Uniformity: ≤ ±3%

• Exposure Intensity: Adjustable 0–30 mW/cm²

• UV Wavelength: 365 nm

• UV Lamp Lifetime: ≥ 20,000 hours

• Resolution: 1 μm (with exposure depth approx. 10× line width)

• Alignment Accuracy: ±1 μm

• Exposure Mode: Double-sided simultaneous exposure

• Rotation Range: ±5°

• Microscope System: Dual-field CCD vision, 1.6X–10X objectives, image processing system, 19″ LCD monitor

• Mask Size: Supports 6″ square masks

• Substrate Size: Suitable for up to 5″ wafers or 3″×3″ substrates, thickness ≤ 5 mm

The K-31D6 Mask Aligner delivers unmatched precision, flexibility, and reliability, making it an essential tool for semiconductor R&D, MEMS fabrication, optoelectronic device processing, and advanced micro-patterning applications.