As Ferrotec continues to expand its global footprint in the high-power semiconductor substrate industry, its Malaysian plant required tailored automation equipment to support advanced production processes while maintaining exceptional standards in precision, yield, and reliability. In response, our engineering team developed and delivered a series of non-standard automated production lines specifically optimized for semiconductor packaging, lamination, and post-processing.

The solution included fully integrated systems for chip lamination, substrate handling, and component alignment, all built with flexibility to accommodate various ceramic and copper-based materials. Our equipment is designed to meet cleanroom-grade specifications, incorporating smart control systems and real-time monitoring to ensure process stability and traceability.

Since deployment, the production lines at the Lintang facility have been operating smoothly, significantly enhancing throughput and operational efficiency while minimizing labor input and process variability. This successful implementation marks another important milestone in Ferrotec’s global supply chain optimization efforts and highlights the growing demand for region-specific intelligent manufacturing solutions.

At Zekta Automation, we are committed to helping advanced manufacturers like Ferrotec scale globally through smart, tailored automation. Our team continues to collaborate closely with Ferrotec’s international branches to deliver robust, future-ready automation solutions that align with evolving semiconductor industry demands.