Founded in 2005 and rooted in a legacy dating back to 1971, Zhenhua Fengguang is a leading high-tech enterprise in China’s microelectronics industry. As a designated Science and Technology Reform Demonstration Enterprise and a recognized “Little Giant” in Guizhou Province, the company has long been committed to innovation in integrated circuit (IC) design, packaging, testing, and technical services. With advanced R&D centers across Guiyang, Chengdu, Xi’an, Shanghai, and Nanjing, the company is known for its strong capabilities in ceramic, metal, plastic, and SIP packaging processes.

To support Zhenhua Fengguang’s increasing demand for high-efficiency, high-reliability production, Zekta Automation engineered a non-standard semiconductor packaging automation line that streamlines complex packaging workflows. Our solution integrates automated chip handling, die attach, wire bonding, inspection, and environmental testing, fully optimized for multiple IC packaging types. The system features real-time data tracking, precision alignment technologies, and modular upgrades to accommodate future process evolution.

This automation line not only enhances production throughput and consistency but also ensures compliance with stringent quality management standards such as ISO9001, ISO14001, ISO45001, and IATF16949, all of which are upheld by Zhenhua Fengguang’s manufacturing environment.

By delivering intelligent, reliable, and scalable automation tailored to the needs of critical IC components—such as amplifiers, memory chips, microprocessors, converters, and power management devices—Zekta Automation plays an integral role in enabling Zhenhua Fengguang’s mission: to drive the advancement of next-generation information technologies through continuous innovation in semiconductor packaging and system integration.

Together, we’re building the future of smart semiconductor manufacturing—one solution at a time.