High-Precision Film Peeling Systems for Delicate Substrates
Zekta’s Film Peeling Machines are engineered for precision and repeatability in removing protective films from a wide range of substrates, including ceramic, glass, PCB, and semiconductor materials. Our patented dual-lane peeling and automated tape-lift technologies ensure high throughput and minimal surface damage—ideal for micro-sized or fragile components. Designed to integrate seamlessly into automated production lines, these systems support customizable configurations to meet evolving manufacturing needs.