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      Ceramic Substrate Film Peeling Machine

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      description

      This machine is designed for precision film peeling of dry film protective layers from ceramic substrates after the exposure process. It is also compatible with other small-sized substrates such as glass or specialty materials, making it versatile for various high-precision applications.

      The system features fully automated loading, dual-substrate simultaneous peeling, and automatic alignment. After processing, four substrates are aligned into a single row and seamlessly conveyed to the developing line for the next stage. This streamlined process ensures high efficiency, consistent performance, and optimal integration into automated production lines.

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      Specifications

      The following specifications are for reference only and can be customized based on actual requirements.

      No.ItemSpecifications
      1Equipment DimensionsL2000×W2000×H2000mm (excluding alarm light height)
      2Equipment WeightApprox. 1300kg
      3Substrate DimensionsWidth: 5 inches (138mm)
      Length: 7 inches (192mm)
      Thickness: 0.1-3.2mm (with copper); Warpage: ≤1mm
      4Edge Exposure1-5mm edge exposure (edge wrapping not suitable for this machine)
      5Buffer System2 buffer units, capacity for 30 substrates
      6Film Peeling MethodCeramic plate tilt at right-angle position for film peeling
      7Efficiency12 substrates/min (excluding tape replacement and film collection time)
      8Working Surface Height1050±50mm
      9Conveying SpeedAdjustable 1-5m/min
      10Film Peeling SpeedAdjustable 1-3m/min
      11Power SupplySingle-phase 220V, 50Hz, 8KW
      12Air Source4-6kg/cm², 100L/min