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      Ceramic Substrate Laminating Machine

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      description

      Our film laminating machine is engineered for precision and reliability, offering superior performance for high-yield applications. Key features include:

      1. Direct Lamination without Pre-Tacking
        The substrate and dry film are simultaneously fed directly beneath the pressure rollers for lamination, eliminating the need for pre-tacking. This reduces the risk of air bubbles and wrinkles during the initial stage.

      2. Multi-Roller Pressure Design
        Equipped with a multi-roller system, the machine ensures stable lamination and compensates for external factors that may cause substrate deviation, minimizing film misalignment and wrinkling.

      3. Dual-Side Lamination Rollers
        Front and rear pairs of pressure rollers enhance adhesion between the dry film and the substrate, significantly improving lamination yield and bonding strength.

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      Specifications

      Rigid/Flexible Board Laminating Machine Series
      The following specifications are for reference only and can be customized based on actual requirements.

      No.ItemSpecifications
      1Equipment DimensionsL2600×W1600×H2000mm (excluding alarm light height)
      2Equipment WeightApprox. 1500kg
      3Substrate DimensionsWidth: 110mm(min.) – 150mm(max.)
      Length: 110mm(min.) – 300mm(max.)
      Thickness: 0.1-3.2mm (with copper); Warpage: ≤1mm
      4Dry Film SpecificationsWidth: 110(min.)-300(max.)mm
      Roll core diameter: 3 inches; Dry film outer diameter: 250mm(max.)
      5Heating TemperatureRoom temperature – 120℃ (±5℃)
      6Pressure Range0.3-0.6kg/cm²
      7Copper Exposure Accuracy±1mm
      8Working Surface Height1050±50mm
      9Conveying SpeedAdjustable 1-5m/min
      10Laminating SpeedAdjustable 1-3m/min
      11Power SupplySingle-phase 220V, 50Hz, 12KW
      12Air Source4-6kg/cm², 200L/min