The ZA2000/3000 Fully Automated Wafer Probe Station is engineered for high-precision semiconductor testing and advanced wafer-level characterization. Its integrated high-accuracy design ensures superior stability and measurement consistency, making it an ideal solution for demanding production and research environments.

Key features include:

• Integrated High-Precision Architecture for stable and accurate probing performance.

• Multi-Cassette Compatibility to support a wide range of wafer handling requirements.

• Multi-Site Testing Capability for enhanced efficiency and throughput.

• Advanced Optical Alignment Module enabling automated and precise probe positioning.

• Docking Interface Support for seamless tester integration.

• Extended Testing Capabilities for high/low temperature, high-voltage, and high-power applications.

This system is designed to deliver exceptional reliability and scalability for semiconductor wafer probing, making it a powerful choice for high-volume manufacturing and advanced device validation.